search.noResults

search.searching

dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
MAKING PROGRESS


Industry representatives take part in a panel discussion at the third Army Innovation Summit in August 2016: from left, David S. Bem of PPG Industries Inc.; Jesse Nunn, Future Research Corp; William “Bill” Phillips, Boeing Defense, Space & Security; and Dr. Robie Samanta Roy, Lockheed Martin Corp. The summits have explored ways the Army and industry can legitimately work together more closely to get the best possible capabilities to the warfighter faster. (U.S. Army photo by Sgt. Eben Boothby, AMC Public Affairs)


assessments (AWAs) and the network integration evaluations (NIEs), the Army’s two primary means to provide Soldier feedback on emerging concepts and capabilities in demanding, opera- tionally realistic settings. Both events are designed to deliver


the Mission Com-


mand Network 2020 and assess interim solutions to AWFCs.


“So,” Van De Hey explained, “there was a pretty robust element that was highly involved with some of what’s happening with the future of the military, and then we brought in the science and technology piece, which does everything from work- ing with DARPA [the Defense Advanced Research Projects Agency] to the differ- ent science boards to working with other


elements, such as megacities, subterrain, counter-UAS [unmanned aerial systems], to major efforts such as FVL, or Future Vertical Lift.”


Te rapid capabilities element was also quite familiar with the Army governance process, including working with the Office of the ASA(ALT) to help shape and influence budgetary planning through the program objective memorandum to support various S&T efforts developed with the Army centers of excellence.


Industry also is, more than ever, a criti- cal player in speeding up the acquisition machine, Dyess said, and is a central focus of ARCIC’s efforts. “Tere’s no prohibition against good ideas,” he said.


“No matter how you slice it, collaboration does remain key to this.”


Te Army Innovation Summits have made cautious strides toward identi- fying barriers between government and industry, particularly during the requirements-generation process. Te third and most recent summit, held in August 2016 in Williamsburg, Virginia, was the first in which industry was invited to participate, but to a limited extent as recommended by government lawyers.


Legal concerns—some of them unfounded, DOD acquisition leaders have stressed—have discouraged Army officials from sharing information on program plans with industry in the past.


Summit participants agreed that the government needs to do a better job of telling industry what it wants, Dyess said. “Tere’s no forum for industry to address the government to [have it] tell them what it wants, and particularly the Army.” Another barrier identified during the summit, he said, was that “small busi- nesses really just don’t have a chance to break in.”


TRADOC and ARCIC responded quickly to both concerns. First, they introduced the Forum for Innovative Novel Discovery (FIND) at the Associa- tion of the United States Army Annual


ASC.ARMY.MIL 31


ACQUISITION


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124  |  Page 125  |  Page 126  |  Page 127  |  Page 128  |  Page 129  |  Page 130  |  Page 131  |  Page 132  |  Page 133  |  Page 134  |  Page 135  |  Page 136  |  Page 137  |  Page 138  |  Page 139  |  Page 140  |  Page 141  |  Page 142  |  Page 143  |  Page 144  |  Page 145  |  Page 146  |  Page 147  |  Page 148  |  Page 149  |  Page 150  |  Page 151  |  Page 152  |  Page 153  |  Page 154  |  Page 155  |  Page 156  |  Page 157  |  Page 158  |  Page 159  |  Page 160  |  Page 161  |  Page 162  |  Page 163  |  Page 164  |  Page 165  |  Page 166  |  Page 167  |  Page 168  |  Page 169  |  Page 170  |  Page 171  |  Page 172  |  Page 173  |  Page 174  |  Page 175  |  Page 176